Title:
Al-Si系粉末合金材料及びその製造方法
Document Type and Number:
Japanese Patent JP4906206
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a lighter material which combinedly has a high thermal conductivity and a low thermal expansion coefficient, and is suitably used as a heat radiation board of a semiconductor device, or the like. SOLUTION: The Al-Si based powder alloy material is obtained by subjecting powder produced by a well-known method such as gas atomizing, and having a composition containing, by mass, 15 to 50% Si, 0 to 0.5% Mg, 0 to 0.5% Cu and 0 to 0.3% Fe, and the balance substantially Al to compacting. In particular, the product obtained by subjecting the compact after cold compacting to solidification by hot extrusion is preferable.
Inventors:
Jun Kusui
Kazuhiko Yokoe
Shigeru Okaba
Kazuhiko Yokoe
Shigeru Okaba
Application Number:
JP2001295769A
Publication Date:
March 28, 2012
Filing Date:
September 27, 2001
Export Citation:
Assignee:
Toyo Aluminum K.K.
NIPPON LIGHT METAL COMPANY,LTD.
NIPPON LIGHT METAL COMPANY,LTD.
International Classes:
B22F1/00; C22C21/02; B22F3/10; B22F3/20; B22F3/24; C22C1/04; C22F1/043; C22F1/00
Domestic Patent References:
| JP61087843A | ||||
| JP2000109944A | ||||
| JP63243245A | ||||
| JP9055460A | ||||
| JP6041667A | ||||
| JP61104043A |
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano