PURPOSE: To provide a grinding wheel which has a grinding characteristic equivalent to a resin bond grinding wheel and with which sensing of touch is practicable.
CONSTITUTION: In a bond phase 3 containing aluminum or aluminum alloy, an abrasive grain layer 4 is provided consisting of dispersion of abrasive grains 1 on whose surfaces inter-metal compound layer 2 of harder nature than the bond phase 3 is formed. Because the bond phase 3 between abrasive grain 1 and super-abrasive grains 1 is soft while the inter-metal compound layer 2 at the periphery of super-abrasive grain 1 is hard, wear propagates first at the bond phase 3 to generate chip pocket certainly. Despite metal bond grinding wheel, therefore. This exerts a grinding performance equivalent to a resin bond grinding wheel. Electroconductiveness of the abrasive grain layer 4 permits easy sensing of touching of metal etc., with the work to be ground.
OSADA MASANOBU
OIKAWA NAOTO
Next Patent: COMPOSITE SUPER-ABRASIVE GRAIN AND MANUFACTURE OF GRINDING WHEEL