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Title:
ALUMINUM ALLOY-CERAMIC COMPOSITE, PRODUCTION METHOD OF THE COMPOSITE AND STRESS BUFFER COMPOSED OF THE COMPOSITE
Document Type and Number:
Japanese Patent JP2016180185
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a production method of an aluminum alloy-ceramic composite, enabling the aluminum alloy-ceramic composite excellent in crack resistance and peeling resistance to be efficiently produced.SOLUTION: According to the invention, the production method of an aluminum alloy-ceramic composite is provided that comprises: a step of impregnating an aluminum alloy into a planar ceramic porous body thereby forming a planar aluminum alloy-ceramic composite base sheet having an aluminum alloy layers on both main surfaces; and a step of introducing linear defect or intermittent defect to at least one main surface of the composite base sheet and then cutting it to form the aluminum alloy-ceramic composite in which the ceramic porous body and the aluminum alloy layer are exposed on a side surface. In the production method of an aluminum alloy-ceramic composite, the ceramic porous body contains at least one of silicon carbide and graphite, ceramic filled amount is 50 mass% or more and the ceramic porous body has a thickness of 0.35 to 3.8 mm, the aluminum alloy has a content of aluminum of 70 mass% or more, the composite base sheet has a thickness of 0.5 mm to 4.0 mm and the aluminum alloy layer has a thickness of 0.01 mm to 0.3 mm.SELECTED DRAWING: None

Inventors:
IWAMOTO GO
HIROTSURU HIDEKI
KOYANAGI KAZUNORI
Application Number:
JP2016094175A
Publication Date:
October 13, 2016
Filing Date:
May 09, 2016
Export Citation:
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Assignee:
DENKA CO LTD
International Classes:
C22C1/10; B22D19/00; B22F7/04; C22C21/00; C22C21/02; H01L23/14; H01L23/36; H01L23/373
Domestic Patent References:
JP2003268482A2003-09-25
JP2000007456A2000-01-11
JP2002235126A2002-08-23
JP2010010538A2010-01-14
JP2005294523A2005-10-20
JPH10264130A1998-10-06
JP2010106362A2010-05-13
JP2001121251A2001-05-08
Foreign References:
WO2009148073A12009-12-10
WO2008123172A12008-10-16
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito