Title:
アルミニウム-セラミックス接合基板およびその製造方法
Document Type and Number:
Japanese Patent JP4543275
Kind Code:
B2
Inventors:
Satoru Ideguchi
Hideyo Koyamauchi
Hideyo Koyamauchi
Application Number:
JP2004063621A
Publication Date:
September 15, 2010
Filing Date:
March 08, 2004
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
B22D19/00; H01L23/14; B22D21/04; C22C21/02; C23C18/32; H01L23/15; H05K1/02
Domestic Patent References:
| JP2003031720A | ||||
| JP2001044345A | ||||
| JP2002329814A |
Attorney, Agent or Firm:
Koichi Okawa