Title:
アルミニウム-セラミックス接合基板およびその製造方法
Document Type and Number:
Japanese Patent JP4669965
Kind Code:
B2
Inventors:
Hideyo Koyamauchi
Mitsuhiro Kosaka
Mutsumi Namioka
Mitsuhiro Kosaka
Mutsumi Namioka
Application Number:
JP2005006716A
Publication Date:
April 13, 2011
Filing Date:
January 13, 2005
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
B22D19/00; H01L23/12; H05K3/00; H05K3/06
Domestic Patent References:
| JP2002076551A | ||||
| JP2003332484A | ||||
| JP51025461A | ||||
| JP2002161755A | ||||
| JP63097353A |
Attorney, Agent or Firm:
Koichi Okawa