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Title:
AMINOFORMALDEHYDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS61268758
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition capable of low-temperature curing with high performance of the coating film formed when used as a crosslinking agent for coatings, by incorporating a resin with a specific amount of a melamine-formaldehyde compound in which the amount of formalin bonded to melamine skeleton and alkoxy-modified degree for the bonded formalin are each specified.

CONSTITUTION: A reaction between melamine and formalin is carried out in such a manner as to be two or three formalin molecules per melamine nucleus, followed by alkyletherification with an excess of alcohol (an aliphatic or alicyclic alcohol except methanol and ethanol, e.g., n-butanol) to prepare a melamine- formaldehyde compound of formula I [oneWfour of R1WR6 are H, the rest being groups of formula II (R' is H or ≥3C alkyl), and also the R1WR6 and R' are assigned so that the ratio of the number of groups of formula II having said alkyl to the whole number of groups of formula II falls between 0.7 and 1]. The objective composition can be obtained by incorporating ≥50mol% of the above melamine-formaldehyde compound in a resin.


Inventors:
KAMATA KAZUNORI
SUZUKI TAKAAKI
SAKATA KENJI
SAITO JUN
MITSUISHI TAKATOSHI
WAKI HIROSHI
Application Number:
JP11029485A
Publication Date:
November 28, 1986
Filing Date:
May 24, 1985
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08G12/32; C08G12/42; C08L61/00; C08L61/20; C08G12/00; C08L61/28; C08L101/00; C09D7/00; C09D7/12; (IPC1-7): C08G12/42; C08L61/28; C08L101/00; C09D7/12
Domestic Patent References:
JPS5540711A1980-03-22