PURPOSE: To lower a noise factor of an active element, by packaging the active element on the top face of a board, attaching a cover within which a vacuum is established on the board so as to cover the active element and providing a thermoelectric cooling unit for cooling the active element on the bottom face of the board.
CONSTITUTION: An active element 2 such as GaAs FET or the like is packaged on the top surface of a board 1 of a material having good heat conductivity such as ceramics or glass. The active element 2 has three leads. The active element 2 is covered with a cover 4 within which a vacuum is established. An thermoelectric cooling unit 5 utilizing the Peltier effect is secured closely to the bottom face of the board 1 directly under the active element 1. The thermoelectric cooling unit 5 has supply lines 6 for cooling elements. The cover 4 used herein is previously shaped into desired configurations and bonded to the board 1. A hole for drawing air is formed in a part of the cover 4. Air is drawn through the hole and the inside of the cover is sealed. If the cover 4 is of glass, it is fusion bonded to the board 1 and the air drawing hole is also thermally fusion bonded.
ABIKO TOSHIO
NUNOTANI HIDEJI
TSUKAMOTO KATSUYA
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