分析面切削用治具、分析装置、分析面切削方法、及び分析方法

Title:

分析面切削用治具、分析装置、分析面切削方法、及び分析方法

Document Type and Number:

Japanese Patent JP7405690

Kind Code:

B2

Abstract:

To make it easy to cut out a highly flat analytical surface from a sample without resorting to expensive or extensive cutting machines.SOLUTION: An analytical surface cutting jig is used together with a sample holding member 10, which holds a sample Z with at least an upper part of the sample Z exposed. The analytical surface cutting jig is used for cutting out an analytical surface of the sample Z by cutting the sample Z with a cutting tool Y. The analytical surface cutting jig includes a base 20 on which the sample holding member 10 is placed and a guide member 30, which is used for guiding the cutting tool Y, and whose upper surface 32 is positioned below the upper part of the sample Z held by the sample holding member 10. The upper surface 32 of the guide member 30 functions as a cut-out guide surface 32 for guiding a cutting edge of the cutting tool Y from one side of the sample Z to the opposite side thereof to cut out the analytical surface.SELECTED DRAWING: Figure 4

More Like This:

JPH0682348	PRODUCTION OF TEST PIECE OF STAINLESS STEEL PIPING WHEREIN TRANSGRANULAR STRESS CORROSION CRACKING IS INTRODUCED
JP2024052505	Ion beam processing method based on optical microscopic imaging
JP2008309495	IDENTIFICATION AND ANALYZING METHOD OF FINE ORGANIC MATTER

Inventors:

Rocky shore

Application Number:

JP2020086626A

Publication Date:

December 26, 2023

Filing Date:

May 18, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HORIBA Techno Service Co., Ltd.

International Classes:

G01N1/28; B23D9/00; G01N21/64; G01N21/65

Domestic Patent References:

JP2015017910A
JP2004503766A
JP2015092179A
JP60150439U
JP2006064693A
JP2014528575A

Attorney, Agent or Firm:

Ryuhei Nishimura
Shindai Saito
Yoshinaga Uemura

Previous Patent: Blister packaging machine and blister sheet manufacturing method

Next Patent: lighting equipment