Title:
Anisotropic conductive film, its manufacturing method, connection method and bonded body
Document Type and Number:
Japanese Patent JP6293524
Kind Code:
B2
Abstract:
An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10°C to 250°C and a heating speed is 10°C/min, and wherein T2 is 30°C or higher, and T4-T2 is greater than 0°C but 80°C or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.
Inventors:
Yasunobu Yamada
Sekiguchi Morio
Shin Kumakura
Sekiguchi Morio
Shin Kumakura
Application Number:
JP2014047154A
Publication Date:
March 14, 2018
Filing Date:
March 11, 2014
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01R11/01; C08J5/18; C09J7/10; C09J9/02; C09J11/04; C09J167/00; C09J201/00; H01B1/20; H01B5/16; H01R43/00
Domestic Patent References:
| JP2007262412A | ||||
| JP2208391A | ||||
| JP2002105221A |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda
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