To laminate and integrally mold a power feeding patch and a power feeding circuit element, to improve a manufacture property and reliability, to suppress the generation of a surface wave mode and to form an excellent radiation pattern.
The power feeding circuit part is constituted of a microstrip line. A part of a one side ground conductor serving also as a connector attaching tool is counterbored and the microstrip line and the tool are prevented from interfering. Also, by counterboring a part of a dielectric, a structure in which a connector and the connection part of a power feeding circuit can be connected by soldering from an upper surface is attained. Also, in the case of constitution for the purpose of band widening for instance, by turning the substrate of the dielectric to the same size as the power feeding patch and making the dielectric forming a non power feeding patch individual for each antenna element, the generation of the surface wave mode which is the problem in a conventional technique is suppressed and the structure forming the excellent radiation pattern is attained.
HARIO KENICHI
TAKAHASHI TORU
