Title:
ANTIBACTERIAL SOLVENTLESS HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3948787
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a medical grade antibacterial hot melt adhesive suitable for use in skin contact applications and capable of sterilization with ethylene oxide under thermal stress or sterilization with a radiation by using an acrylic polymer containing a dispersed antibacterial substance.
SOLUTION: This adhesive is an antibacterial one for use in skin contact applications and comprises an acrylic polymer (A) containing a low-molecular- weight solid acrylic polymer having a molecular weight of about 90,000-120,000 and a medium-molecular-weight solid acrylic polymer having a molecular weight of about 140,000-160,000 in a ratio of about 1:4 and having a melting temperature of about 275-350° F and about 0.1-2wt.% antibacterial substance iodomethyl-p- tollylsulfonic acid distributed throughout the entire polymer. A pressure-sensitive adhesive composition is obtained by optionally adding an effective amount of a tackifier to the above adhesive.
Inventors:
David Di Cox
Robert E. Lund
Leland W. Annette
Robert E. Lund
Leland W. Annette
Application Number:
JP15399697A
Publication Date:
July 25, 2007
Filing Date:
June 11, 1997
Export Citation:
Assignee:
MEDICAL CONCEPTS DEVELOPMENT,INC.
International Classes:
A61L2/16; A61B19/08; C09J133/00; A61F13/02; A61K9/70; A61L15/46; A61L15/58; C09J5/06; C09J11/06; C09J133/08; (IPC1-7): C09J5/06; A61K9/70; A61L2/16; A61L15/58; C09J11/06
Domestic Patent References:
| JP60054301A | ||||
| JP7017812A | ||||
| JP3215586A |
Attorney, Agent or Firm:
Hironobu Onda