To improve cooling efficiency and packaging density in an apparatus for mounting a plurality of electronic circuit packages.
An apparatus 30 is provided with a support member 32 and a connector 33 that is supported by the support member 32. A group of terminals are disposed in the connector 33 along its lengthwise direction. An electronic circuit package 31 includes a terminal portion 34 wherein the group of terminals is provided. The electronic circuit package 31 is guided to a fitting position of the connector 33 while being slid along the lengthwise direction of the connector 33. In the fitting position of the connector 33, the group of terminals provided in the terminal portion of the electronic circuit package 31 faces the group of terminals in the connector 33, and the group of terminals in the electronic circuit package 31 and the group of terminals in the connector 33 are electrically connected.
YAMADA MASAHIRO
Kawai Nobuaki
Yasuhisa Tanizawa