To stably form a film through sputtering, by inhibiting overdischarge occurring when forming the film through sputtering while rotating a rotation drum.

The apparatus for forming a film through sputtering has the rotatably installed rotation drum and a substrate holder in a chamber, so as to form the film onto a substrate mounted on the substrate holder through sputtering a target in the chamber, while rotating the rotation drum. The substrate holder 13 comprises: the top ends 131a and 131b set at the ground potential; an attachment section 121 which hangs the top ends 131a and 131b and is arranged in the top perimeter of the rotation drum; the bottom ends 132a and 132b arranged on the bottom perimeter of the rotation drum; and an accommodation section 122 which supports the bottom ends 132a and 132b, and is set at the ground potential. The bottom ends 132a and 132b of the substrate holder 13 are pushed by a flat spring 50, and electrically connected to and held by the accommodation section 122.