Title:
APPARATUS AND METHOD FOR ADHERING SEALING GLASS OF OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3166288
Kind Code:
B2
Abstract:
PURPOSE: To provide an apparatus and a method for adhering sealing glass of an optical semiconductor device in which the glass can be pressed to a package by uniform force without damaging a surface of the glass and which has high operating efficiency.
CONSTITUTION: The apparatus for adhering a sealing glass comprises a package base 12 for positioning a package, and a pin holder 14 to be superposed on the base. The base has a plurality of recesses 16 for positioning the packages. The holder 14 has a plurality of pins 30 energized downward by a compression coiled spring 36. Pin group made of the plurality of pins 30 is disposed corresponding to the recess. The apparatus also comprises a positioning pin 20 for positioning the base and the holder, and a latching mechanism 40 for latching the base and the holder to each other. The glass previously coated with solid adhesive resin is set to the package on the base. The base and the holder are latched by the mechanism, and introduced into a heating furnace.
Inventors:
Yoshiharu Takahashi
Application Number:
JP10917392A
Publication Date:
May 14, 2001
Filing Date:
April 03, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/02; (IPC1-7): H01L23/02; H01L33/00
Domestic Patent References:
| JP2252258A | ||||
| JP61104644A |
Attorney, Agent or Firm:
Kuninori Funabashi