Title:
基板高さを測定する装置及び方法
Document Type and Number:
Japanese Patent JP7331238
Kind Code:
B2
Abstract:
An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.
Inventors:
Rogachevsky, Andrei, Valerievich
de Nibel, Martin, Jules, Marie-Emile
Giesswerzen, Aryan
Pongels, Willem, Richard
Troglick, Victor
de Nibel, Martin, Jules, Marie-Emile
Giesswerzen, Aryan
Pongels, Willem, Richard
Troglick, Victor
Application Number:
JP2022501180A
Publication Date:
August 22, 2023
Filing Date:
June 15, 2020
Export Citation:
Assignee:
ASM L Netherlands B.V.
International Classes:
G03F9/02; G01B11/22; G01B13/14
Domestic Patent References:
| JP2007049165A | ||||
| JP2001143991A | ||||
| JP2004039707A | ||||
| JP2010109378A | ||||
| JP2010016372A |
Attorney, Agent or Firm:
Kenki Morishita
Takeshi Aoki
Takeshi Aoki