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Patent Searching and Data


Title:
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH04199794
Kind Code:
A
Abstract:

PURPOSE: To eliminate a problem of easy positional deviation by operating a transfer head also as a transfer head for taking up an electronic component with leads of an electronic component supply feeder by the head and transferring to place it on a board.

CONSTITUTION: A tape feeder 20 having a both-side adhesive single piece 18 adhered to a peeling tape, and a transfer head 11 having an adhering element 40 for adhering to take up the piece 18 on the peeling tape fed from the feeder 20 and transferring to adhere it to a board 1 positioned at a positioning unit 2, are provided. The element 40 is freely replaced with an electronic component suction nozzle 50, and the head 11 is used also as a transfer head for taking up the component with leads of electronic component supply feeders 6, 7 and transferring to place on a board. Thus, the component can be momentarily adhered on the board, and the positional deviation of the component is eliminated.


Inventors:
SAKAI TADAHIKO
Application Number:
JP33391590A
Publication Date:
July 20, 1992
Filing Date:
November 29, 1990
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/02; (IPC1-7): H05K13/02
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)