PURPOSE: To prevent chemical solution from falling down to a wafer when it is applied on the rotating wafer and to avoid ununiform application, by providing a nozzle extending from the outside of the periphery of the wafer obliquely to over the wafer and having the end opening directed upwards.

CONSTITUTION: A wafer 2 carried fixedly on a rotary table 1 is supplied in drops of a chemical solution such as photoresist 4 or the like, which is pressure fed through and discharged from a nozzle 3 extending from the outside of the periphery of the wafer 2 obliquely to over the wafer, the end opening thereof being directed upwards. Then, the rotary table 1 and hence the wafer 2 are rotated, whereby the photoresist 4 on the wafer 2 crawls over toward the peripheral region of the wafer and it can be applied thereon uniformly. According to such constitution, no photoresist 4 is gathered in the end opening of the nozzle 3. Even if it is gathered there, it is prevented from falling down to the wafer since it will go along the underside of the nozzle up to point P which is located on the outside of the periphery of the wafer 2.