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Title:
AQUEOUS EMULSION FOR SEED POLYMERIZATION
Document Type and Number:
Japanese Patent JP2004161916
Kind Code:
A
Abstract:

To provide an adhesive excellent in adhesive strength, film formability, workability and low-temperature adhesivity even without comprising a plasticizer, to provide an aqueous emulsion giving the adhesive, and to provide an aqueous emulsion for seed polymerization giving the above aqueous emulsion.

The aqueous emulsion for seed polymerization, containing a polymer(A) obtained by copolymerization between ethylene and a vinyl ester, is such that ethylene-derived structural units therein account for 38-70 pts.wt. to 100 pts.wt. of the total structural units therein. The aqueous emulsion(B) is obtained further by seed polymerization of at least one monomer selected from the group consisting of vinyl ester, acrylic ester, methacrylic ester, aromatic vinyl compound and vinyl halide to the aqueous emulsion for seed polymerization. The adhesive comprises the aqueous emulsion(B).


Inventors:
SADA TOMOAKI
SHIBATA YUTAKA
Application Number:
JP2002330378A
Publication Date:
June 10, 2004
Filing Date:
November 14, 2002
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F2/16; C08F291/00; C09J157/00; (IPC1-7): C08F2/16; C08F291/00; C09J157/00
Attorney, Agent or Firm:
Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto