Title:
ASSEMBLY COMPOSED OF TANTALUM OR TUNGSTEN TARGET AND PACKING PLATE MADE FROM COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3905301
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an assembly composed of a tantalum or tungsten target and a backing plate, resistant to a high power sputter, of which the deformation after diffusion bonding is small even when a thermal expansion rate of a target material is much different from that of the backing plate, and which does not cause an exfoliation or a crack between the target and the backing plate; and to provide a manufacturing method therefor.
SOLUTION: The assembly composed of the tantalum or tungsten target and the backing plate made from the copper alloy is characterized by that the tantalum or tungsten target and the backing plate made of copper alloy are diffusion bonded through an inserted material made from an aluminum or aluminum alloy sheet of 0.5 mm or thicker, and by that they have diffusion bonded layers between themselves and the inserted material.
Inventors:
Kunihiro Oda
Takeo Okabe
Hirohito Miyashita
Takeo Okabe
Hirohito Miyashita
Application Number:
JP2000332159A
Publication Date:
April 18, 2007
Filing Date:
October 31, 2000
Export Citation:
Assignee:
Nikko Metal Co., Ltd.
International Classes:
B23K20/00; C23C14/34; B23K20/14; B23K20/16; B23K101/36; (IPC1-7): C23C14/34; B23K20/00; B23K20/14; //B23K101:36
Domestic Patent References:
| JP62202732A | ||||
| JP2000239837A | ||||
| JP11236665A | ||||
| JP2001295040A | ||||
| JP2000239838A | ||||
| JP6158296A | ||||
| JP6172993A | ||||
| JP6108246A |
Foreign References:
| US6071389 |
Attorney, Agent or Firm:
Isamu Ogoshi
Yohei Kinoshita
Yohei Kinoshita
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