Title:
Ａｕ−Ｓｎ−Ａｇ系はんだ合金とはんだ材料並びにこのはんだ合金又ははんだ材料を用いて封止された電子部品及び電子部品搭載装置
Document Type and Number:
Japanese Patent JP6413668
Kind Code:
B2
Abstract:
[Object] To provide an Au-Ag-Sn-based solder alloy for high temperature use that is so good at reflow wettability as to be sufficiently usable in reflow bonding of crystal quartz devices, SAW filters and MEMS, wherein, in particular, the solder alloy costs low and is excellent in solderability, reflow wettability and reliability. [Measures for Solution] An Au-Sn-Ag-based solder alloy containing Sn, Ag, Au and elements that are inevitably contained owing to manufacture procedure, characterized by having a composition adjusted so that a solidus temperature is within a range of 280-400°C with a gap between the solidus temperature and the liquidus temperature being within 40°C.
Inventors:
Hiroaki Nagata
Eiji Murase
Juichi Shimizu
Eiji Murase
Juichi Shimizu
Application Number:
JP2014228793A
Publication Date:
October 31, 2018
Filing Date:
November 11, 2014
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
B23K35/30; C22C1/02; C22C5/02; H05K3/34
Domestic Patent References:
| JP2008155221A | ||||
| JP2014151329A | ||||
| JP2009190055A | ||||
| JP2009220147A |
Foreign References:
| WO2006049024A1 | ||||
| WO2010010833A1 |
Attorney, Agent or Firm:
Shinohara International Patent Office
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki