PURPOSE: To obtain an apparatus capable of automatically and uniformly coating a coating agent without wastefulness, in coating the surface of a semiconductive wafer with wax (adhesive), by downwardly directing a surface to be coated to bring the same into contact with the coating agent before rotating the same.

CONSTITUTION: A wafer is carried on the sucking support surface 12 of the vacuum chuck 13 provided to a chuck main body 15 at a position shown by the two dots chain line and a support 18 is revolved by 180° around a shaft 17 in such a state that the wafer is sucked to said support surface 12 to bring the chuck main body 15 to a position shown by the solid line. Herein, the wafer is immersed in an adhesive 6 and a container 7 filled with the adhesive 6 is raised by a cylinder apparatus 9 through a guide body 10, a movable part 11 and a support part 8. Whereupon, the opening end part of the container 7, that is, the adhesive 6 filling the interior thereof under pressure is contacted with the under surface of the wafer W at the upper limit position thereof to be adhered thereto. At this time, when the container 7 is fallen and an electromotor 16 is operated to rotate the chuck 13, the adhesive 6 receives centrifugal force to be spread on the under surface of the wafer W and a uniform thickness layer is formed and, in this state, the chuck main body 15 is returned to the two dots chain line position.