To provide a backside-illuminated distance measuring sensor and a distance measuring device capable of detecting distance at high precision.
The backside-illuminated distance measuring sensor 1 includes a semiconductor board 1A having an image capturing region 1B which is composed of a plurality of two dimensionally arranged pixels P(m, n). Two electric charges (Q1, Q2) are output from the respective pixels P(m, n) as the signals d'(m, n) which have the above distance information. Respective pixels P(m, n) as micro distance measuring sensors output the signals d'(m, n) according to the distance to an object H so that, when the image of the reflected light from the object H is formed on the image capturing region 1B, the distance image of the object can be obtained as aggregates of the distance information to the respective points on the object H. It is preferable that unnecessary carriers disappear in the recombination region 1C of visible light exciting carriers and do not reach the region just below a photo-gate electrode PG. Furthermore, near-infrared light is absorbed in the region at the depth of 10 μm or more and 100 μm or less.
COPYRIGHT: (C)2009,JPO&INPIT
Takashi Suzuki
Seiichiro Mizuno
Mitsutaka Takemura
| JP2005235893A | ||||
| JP6053615A | ||||
| JP2008122342A | ||||
| JP7153986A |
Shiro Terasaki
Satoru Ishida