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Patent Searching and Data


Title:
BAGGING PACKAGE
Document Type and Number:
Japanese Patent JPH03126556
Kind Code:
A
Abstract:

PURPOSE: To obtain a package having excellent pinhole resistance, shock resistance, flexibility and transparency by using a composite film in which a polyamide resin layer, a resin for bonding as a cushioning material layer, a polyamide resin layer, a resin layer for bonding and a sealant resin layer are laminated in the order from the outside.

CONSTITUTION: A composite film in which a polyamide resin layer A, a resin layer B for bonding as a cushioning material layer, a polyamide resin layer C, a resin layer D for bonding and a sealant resin layer E are laminated in the order from the outside is employed. Nylon 6 is proper as the resin layer A and the copolymer, etc., of nylon 6 and nylon 6-6 as the resin layer C. A monobasic unsaturated fatty acid or an acid modified olefin resin is used as the resin layers B and D. An olefin resin and an ethylene copolymer can be used as the resin layer E.


Inventors:
MATSUI ICHIRO
Application Number:
JP26403089A
Publication Date:
May 29, 1991
Filing Date:
October 12, 1989
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D65/40; B32B27/34; (IPC1-7): B32B27/34; B65D65/40