BARREL GRINDING METHOD AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT USING THEREFOR

Title:

BARREL GRINDING METHOD AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT USING THEREFOR

Document Type and Number:

Japanese Patent JP2002066903

Kind Code:

A

Abstract:

To provide a barrel grinding method having excellent grinding efficiency and adsorbing efficiency and a manufacturing method for an electronic component using therefor.

A ceramic sintering element 2 is put in a barrel grinding pot 1 with grinding media 3 and adsorbing media, and barrel ground. The grinding media 3 are made from ceramic material and the like including abrasive grains of Al2O3. The adsorbing media 4 are made from resin easy to generate static electricity (for example, nylon) or cohesive material (for example, silicon). Taken the specific gravity of the ceramic sintering element 2 as x, the specific gravity of the grinding media 3 as y, and the specific gravity of adsorbing media 4 as z, the grinding media 3 and the adsorbing media 4 satisfy the following expressions (1), (2). y-x≥-0.5...(1) z-x<-0.5...(2).

Inventors:

UKUMA YUJI
SANADA YUKIO
KUROIWA SHINICHIRO
YONEDA YASUNOBU

Application Number:

JP2000256436A

Publication Date:

March 05, 2002

Filing Date:

August 25, 2000

Export Citation:

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Assignee:

MURATA MANUFACTURING CO

International Classes:

B24B31/02; (IPC1-7): B24B31/02

Attorney, Agent or Firm:

Morishita Takeichi

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