To provide a plating device where, even in the case miniaturization is progressed, a plating film with a desired thickness can be securely formed on a part requiring the formation of the plating film.
In the barrel plating device where the inside of a barrel 2 is charged with the object to be plated such as an electronic component element assembly, and, in a state where the barrel 2 is dipped into a plating liquid 22, the barrel 2 is rotated, so as to apply plating thereto, a holding plate 15 and a cylinder 19 as axial angle adjustable apparatuses of changing the axial direction of the barrel 2 so that the axial direction of the barrel 2 is made into an angle tilted from the horizontal direction are provided, the axial angle is changed by driving the cylinder 19, and the barrel 2 is dipped into the plating liquid 22 in a state of being tilted.
| JPH06264299 | BARREL |
OKURA TAKESHI
SUMIKATA MASARU
KIKUCHI AKINORI
| JPH1053897A | 1998-02-24 | |||
| JP2005307281A | 2005-11-04 | |||
| JP2001131798A | 2001-05-15 |
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