半導体基板配線のバリア層及び配線構造

Title:

半導体基板配線のバリア層及び配線構造

Document Type and Number:

Japanese Patent JP3554665

Kind Code:

B2

Inventors:

Naoaki Kogure
Hiroaki Inoue
Hirokazu Ezawa
Masahiro Miyata

Application Number:

JP27049297A

Publication Date:

August 18, 2004

Filing Date:

September 17, 1997

Export Citation:

Assignee:

Ebara Corporation
Toshiba Corporation

International Classes:

H01L21/28; C23C18/31; C25D7/12; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; H01L21/28

Domestic Patent References:

JP8316236A
JP4218919A

Attorney, Agent or Firm:

Takashi Kumagai
Yu Takagi

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