Title:
基材レス粘着テープ
Document Type and Number:
Japanese Patent JP7127154
Kind Code:
B2
Abstract:
The present invention relates to a substrate-free adhesive tape that is excellent in adhesive physical properties and is suitable for a continuous process.
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Inventors:
Ki Seung Seo
The Hee Kim
San Juan Kim
Jun Hyun Park
Kyung Jun Yoon
The Hee Kim
San Juan Kim
Jun Hyun Park
Kyung Jun Yoon
Application Number:
JP2020565251A
Publication Date:
August 29, 2022
Filing Date:
August 06, 2019
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C09J7/38; C09J7/10; C09J133/14
Foreign References:
US20170166786 | ||||
KR20170115197A |
Attorney, Agent or Firm:
Shinya Mihiro
Takashi Watanabe
Takashi Watanabe
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