Title:
基礎断熱構造
Document Type and Number:
Japanese Patent JP7331631
Kind Code:
B2
Abstract:
To provide a foundation heat insulation structure in which, when a floor surface of a floor part is lower than a top end surface of a foundation, the floor part is formed to be a floor, and which allows heat insulation of the foundation while securing habitability of an indoor space.SOLUTION: An foundation heat insulation structure 1 is a heat insulation structure of a foundation 3 supporting a building 2, and is provided with an upper side heat insulation material 5 arranged on a rising surface 31b of a rising part 31 of the foundation 3 on an upper side of a floor part 4 having a lower floor surface 41a than a top end surface 31a of the foundation 3, and a lower side heat insulation material 6 placed vertically apart from the upper side heat insulation material 5 and arranged on the rising surface 31b on a lower side of the floor part 4. The upper side heat insulation material 5 is placed in contact with the floor part 4 and the lower side heat insulation material 6 is placed in contact with the floor part 4 and the upper side heat insulation material 5 is placed between an upper end part 31c of the rising part 31 and a lower end part of an inner wall 13 of the building 2 in a state where an end part of the floor part 4 is placed between the upper side heat insulation material 5 and the lower side heat insulation material 6.SELECTED DRAWING: Figure 3
Inventors:
Toshimasa Uemura
Shota Asano
Eriko Musute
Shota Asano
Eriko Musute
Application Number:
JP2019197968A
Publication Date:
August 23, 2023
Filing Date:
October 30, 2019
Export Citation:
Assignee:
Sekisui House, Ltd.
International Classes:
E02D27/01; E04B1/76
Domestic Patent References:
| JP5280106A | ||||
| JP2016166489A | ||||
| JP2005213837A | ||||
| JP2016216897A | ||||
| JP2017066689A | ||||
| JP2010209656A |
Foreign References:
| US20140182221 |
Attorney, Agent or Firm:
Mitsuhiko Watanabe