Title:
BENDABLE WIRING BOARD, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3183828
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize a semiconductor device which can be assembled without producing a gap between a buffer layer and a semiconductor support board and mounted preventing a wiring section from bulging or bursting out due to a reflow carried out at mounting by a method wherein the buffer layer is divided into sub-layers which are each smaller than a certain value in length in a certain direction.
SOLUTION: A polyimide film 6 of continuous length and with epoxy adhesive agent 7 is subjected to punching for the formation of windows. Then, an electrolytic copper foil is bonded by thermocompression through the intermediary of the polyimide film 6, photosensitive resist is applied onto the rolled copper foil and baked, a pattern is projected onto the photoresist for light exposure, the resist is developed for the formation of an etching mask. Then, the copper foil 6 is etched in ferric chloride, and the resist is separated off for the formation of a copper wiring 8. A metal mask of line/space with 0.15mm/2mm and thickness 150μm is laid on a bendable wiring board 8, and a buffer layer 5 composed of elastomer divided into pieces each 2mm or below in length in a certain direction is formed. Therefore, a semiconductor device of this constitution can be protected against interfacial delamination caused by expansion at heating.
Inventors:
Masahiko Ogino
Akira Nagai
Shuji Eguchi
Masanori Segawa
Toshiaki Ishii
Hiroyoshi Ozumi
Rie Hattori
Ichiro Asho
Kunihiro Tsubozaki
Chuichi Miyazaki
Mamoru Mita
Norio Okabe
Akira Nagai
Shuji Eguchi
Masanori Segawa
Toshiaki Ishii
Hiroyoshi Ozumi
Rie Hattori
Ichiro Asho
Kunihiro Tsubozaki
Chuichi Miyazaki
Mamoru Mita
Norio Okabe
Application Number:
JP18778696A
Publication Date:
July 09, 2001
Filing Date:
July 17, 1996
Export Citation:
Assignee:
株式会社日立製作所
日立電線株式会社
日立電線株式会社
International Classes:
H01L21/60; H01L23/12; H01L23/40; H05K1/00; H05K1/02; H05K3/00; (IPC1-7): H01L23/12; H01L21/60; H01L23/40
Domestic Patent References:
| JP9116041A | ||||
| JP699568A | ||||
| JP712237U |
Attorney, Agent or Firm:
Kiyoshi Maruyama (7 outside)