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Patent Searching and Data


Title:
BENDING METHOD AND DIE DEVICE
Document Type and Number:
Japanese Patent JP2000317550
Kind Code:
A
Abstract:

To provide a method and a die simultaneously forming and bending a work at a bending portion when bending a plate like work to a V shape.

When bending a plate like work by a male die 1 and a female die 3, that is a bending/forming method by which bending and forming are simultaneously executed by pressing a bending portion of a work into a forming recessed part 1C formed to the male die 1 with an elastic member 19 arranged to the female die 3, in a die device consisting of the male die 1 and the female die 3 for bending the plate like work, the forming recessed part 1C is formed to a bending part 1B of the male die 1, a die block 9 having a groove 7 for bending and an elastic member 19 to press the work into the forming recessed part 1C with moving relative to the die block 9 are arranged to the female die 3.


Inventors:
HARAGA YOSHIO
TAGUCHI AKIRA
Application Number:
JP13455799A
Publication Date:
November 21, 2000
Filing Date:
May 14, 1999
Export Citation:
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Assignee:
AMADA CO LTD
International Classes:
B21D22/06; B21D5/02; B21D22/10; B21D35/00; (IPC1-7): B21D35/00; B21D5/02; B21D22/06; B21D22/10
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)