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Title:
Bi-Sb ALLOY PLATING SOLUTION FOR ELECTROPLATING
Document Type and Number:
Japanese Patent JP2020169360
Kind Code:
A
Abstract:
To provide a plating solution for electroplating and an electroplating method using the same, for obtaining a plating film (Bi-Sb alloy plating film) by metal deposition reduction from an aqueous solution.SOLUTION: A plating solution for electroplating includes a methanesulfonic acid, an organic acid, a nonionic surfactant, bismuth, and antimony.SELECTED DRAWING: None

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Inventors:
IWASAKI YASUNORI
TAMURA RYUICHI
Application Number:
JP2019071475A
Publication Date:
October 15, 2020
Filing Date:
April 03, 2019
Export Citation:
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Assignee:
OKUNO CHEM IND CO
International Classes:
C25D3/54; C25D7/10
Domestic Patent References:
JPH03503068A1991-07-11
JP2017053032A2017-03-16
JP2001011687A2001-01-16
JPH0781196B21995-08-30
JP2001020955A2001-01-23
JP2013204809A2013-10-07
JP2008248348A2008-10-16
JP2019026923A2019-02-21
JPS6314887A1988-01-22
Foreign References:
CN105220187A2016-01-06
Other References:
木村祐介: "ビスマスおよびビスマス合金めっき皮膜の物性", 表面技術, vol. ２０１８年３月号第６９巻３号, JPN7022005929, 1 March 2018 (2018-03-01), JP, pages 108 - 111, ISSN: 0005044261
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office



 
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