Title:
ビスフェノールＦ骨格含有フェノキシ樹脂、その製造方法、及びそれを用いた樹脂組成物
Document Type and Number:
Japanese Patent JP6722485
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a phenoxy resin excellent in low viscosity, transparency, adhesiveness and storage stability and suitably usable in a dry film type adhesive used when a touch panel and a frame printed cover panel are laminated, and a composition thereof.SOLUTION: There is provided a bisphenol F skeleton-containing phenoxy resin having a structure represented by the following general formula (1) in a main chain, weight average molecular weight of 30000 to 60000 in terms of polystyrene, ratio of weight average molecular weight and number average molecular weight of 3.5 to 6.5 and ratio of molecular weight at maximum intensity by a static polygonal light scattering method and molecular weight of maximum intensity by specific refractive index of 3.0 to 15.SELECTED DRAWING: None
Inventors:
Shuichiro Hase
High Yasuyuki Oo
Tsutomu Goto
High Yasuyuki Oo
Tsutomu Goto
Application Number:
JP2016060540A
Publication Date:
July 15, 2020
Filing Date:
March 24, 2016
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08G65/38; C09D163/02; C09D171/10; C09J163/02; C09J171/10
Domestic Patent References:
| JP2016023225A | ||||
| JP10168158A | ||||
| JP2014198762A |
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse