Title:
BLAZING ALLOY CONTAINING SILVER AS PRINCIPAL INGREDIENT FOR DENTAL USE
Document Type and Number:
Japanese Patent JPS5329225
Kind Code:
A
Abstract:
Silver base dental solder alloy, contg. (by wt.) 50-85% Ag; 6-15% Au; 0.1-7% Pa; 5-20% Cu; and 1-8% In. The alloy may also contain =6% Sn; and the pref. alloys have the compsn. (a) 69% Ag, 12.1% Au, 4.1% Pd, 11% Cu, and 3.8% Inf or (b) 69% Ag, 10.2% Au, 1.0% Pd, 11% Cu, 5.9% In, and 2.9% Sn. Use in the soldering of palladium-silver dental alloys. The solder alloy is free from cadmium, which can form volatile toxic cpds. during soldering. The colour of the solder matches that of the Pd/Ag alloys; and its low density means that it is less expensive than conventional white dental solders.
Inventors:
ERUKE BIBERUBATSUHA
NIRUSU HARUMUZEN
NIRUSU HARUMUZEN
Application Number:
JP7226477A
Publication Date:
March 18, 1978
Filing Date:
June 20, 1977
Export Citation:
Assignee:
HERAEUS GMBH W C
International Classes:
C22C5/06; A61K6/04; B23K35/30; C22C5/08; (IPC1-7): A61C13/20; B23K35/22; C22C5/08