Title:
BLISTER PACKAGE
Document Type and Number:
Japanese Patent JP3289747
Kind Code:
B2
Abstract:
PURPOSE: To provide a blister package having a bending line which can be made simultaneously with the molding and bent accurately and which has a higher bending strength than perforations.
CONSTITUTION: A bending line 43 to fold a specified part of an exterior material or a holder of a blister package is constituted of a stepwise ruled line formed by a level difference of a metallic mold 50 on forming with vacuum.
Inventors:
Eiko Yamada
Chikako Togashi
Chikako Togashi
Application Number:
JP28181293A
Publication Date:
June 10, 2002
Filing Date:
October 15, 1993
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B65D75/36; (IPC1-7): B65D75/36
Domestic Patent References:
| JP52121666A | ||||
| JP63131971U | ||||
| JP3114325U |
Attorney, Agent or Firm:
Osamu Matsumura
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