To provide a method for manufacturing a board having built-in elements, wherein built-in chips occupy lesser mounting areas, wherein very fine wiring patterns are formed in capacitor elements built to decrease part accommodating layer thickness and in the circuit board, and wherein chip passive parts such as LCR (inductance, capacitance, resistance) elements are accurately mounted while they are being connected to the wiring patterns.
The board having built-in elements is a printed circuit board having one or more insulating layers. The capacitor elements are built in the insulating layers, and are constituted of a plurality of electrodes and dielectric layers which are alternately stacked up. Further, when the capacitor element dielectric layers contain dielectric fillers, at least a thermoplastic resin and/or a thermosetting resin, an appropriately flexible board having built-in elements is manufactured.
TONEGAWA MASAHISA
SATO JIN
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