Title:
基板高さ測定装置および基板高さ測定方法
Document Type and Number:
Japanese Patent JP7280431
Kind Code:
B2
Abstract:
A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.
Inventors:
山▲崎▼ 智広
Application Number:
JP2022507073A
Publication Date:
May 23, 2023
Filing Date:
March 11, 2020
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/08; H05K13/04
Domestic Patent References:
| JP2011233738A | ||||
| JP2008277451A | ||||
| JP2009027015A | ||||
| JP2018200937A |
Foreign References:
| WO2018216132A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Kyoritsu Patent Office