Title:
BOARD MOUNTING STRUCTURE, LIQUID CRYSTAL DEVICE, ELECTRONIC APPARATUS, BOARD PRODUCING METHOD, LIQUID CRYSTAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD
Document Type and Number:
Japanese Patent JP2003280536
Kind Code:
A
Abstract:
To provide a board mounting structure for preventing a molding material from flowing out to an area where a mold is not required.
Weir members 95 are formed between a first area 100a with an output electrode 94 formed therein, and a second area 100b with an input electrode 93 formed therein in a projected area 100. Then the molding member is prevented from flowing out from the first area 100a to the second area 100b. Thus, the input electrode 93 is not covered by silicon, etc., but reliably exposed, so that conductive connection is reliably performed between the input electrode 93 and a wiring board 98, etc.
Inventors:
OBARA NORIHISA
Application Number:
JP2002081064A
Publication Date:
October 02, 2003
Filing Date:
March 22, 2002
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1345; G09F9/00; G09F9/30; G09F9/35; H01L23/28; H01L51/50; H05K3/28; H05B33/14; (IPC1-7): G09F9/00; G02F1/1345; G09F9/30; G09F9/35; H01L23/28; H05K3/28
Attorney, Agent or Firm:
Masayanagi Ueyanagi (2 outside)