Title:
基板処理システム
Document Type and Number:
Japanese Patent JP7002874
Kind Code:
B2
Abstract:
To provide a substrate processing system which can appropriately perform a process to thin a substrate and which is small in footprint.SOLUTION: A substrate processing system 1 operable to thin a wafer W comprises: a plurality of chucks for holding the wafer W; a freely rotatable turntable 100; grinding units 170, 180, 190 for grinding a processed face of the wafer W held by the plurality of chucks; an alignment unit 130 for adjusting a horizontal direction of the wafer W before being held by the plurality of chucks; and a second cleaning unit for cleaning the processed face of the wafer W after grinding. The alignment unit 130 and the second cleaning unit are provided by stacking them in a vertical direction outside the turntable 100 in plane view.SELECTED DRAWING: Figure 1
More Like This:
| JP6815692 | Wafer processing method |
| WO/1988/006949 | MACHINE TOOL FOR ABRASIVE MACHINING |
| JP2021160068 | ULTRASONIC GRINDING WHEEL |
Inventors:
Takeshi Tamura
Munehisa Kodama
Munehisa Kodama
Application Number:
JP2017141593A
Publication Date:
January 20, 2022
Filing Date:
July 21, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B7/04; H01L21/304; H01L21/677
Domestic Patent References:
| JP2015199158A | ||||
| JP2011040637A | ||||
| JP2014082470A | ||||
| JP2013145776A | ||||
| JP2001358096A | ||||
| JP2000135475A | ||||
| JP2011101913A | ||||
| JP2005123653A | ||||
| JP2004014670A | ||||
| JP2015019053A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita
Previous Patent: Installation structure of spacers for reinforcing bars of bathroom floor members and bathroom floor ...
Next Patent: Receiver circuit
Next Patent: Receiver circuit