Title:
基板処理システム
Document Type and Number:
Japanese Patent JP7076557
Kind Code:
B2
Abstract:
This substrate processing system is equipped with a processing device for processing a substrate and a first transport device for transporting the substrate into and from the processing device, wherein the processing device is equipped with a rotating table and four chuck tables, a first transfer position, a second transfer position, a first processing position and a second processing position are provided around the center axis of rotation of the rotating table, the first and second transfer positions are positions where the transfer of the substrate to and from the chuck tables occurs, and the first and second processing positions are positions where a grinding tool or polishing tool processes the substrate held by the chuck tables.
Inventors:
Munehisa Kodama
Application Number:
JP2020538236A
Publication Date:
May 27, 2022
Filing Date:
July 17, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B7/00; B24B41/047; B24B41/06; H01L21/304; H01L21/677
Domestic Patent References:
| JP61297072A | ||||
| JP2016051872A | ||||
| JP2011165994A | ||||
| JP2012076171A | ||||
| JP2002050597A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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