Title:
BONDED STRUCTURE OF GLASS PART
Document Type and Number:
Japanese Patent JP3211455
Kind Code:
B2
Abstract:
PURPOSE: To provide the bonded structure of a glass part, wherein the glass part can be bonded at high adhesion force.
CONSTITUTION: A semiconductor pressure sensitive chip 1 is bonded on a glass stage 2. At the lower surface of the glass stage 2, an aluminum layer (Al) layer 9, a titanium (Ti) layer 10, a nickel (Ni) layer 11 and a gold (Au) layer 12 are laminated sequentially by vapor deposition. As the thickness of the layers, the aluminum (Al) layer 9 is 1,000&angst thick or less, the titanium (Ti) layer 10 is 3,000±1,000&angst thick, the nickel (Ni) layer 11 is 6,000±1,000&angst thick and the gold (Au) layer 12 is 800±400&angst thick. A gold (Au) layer 15 is plated on the 42 alloy of a metal stem 3. The plating of the gold (Au) layer 15 of the metal stem 3 and the gold (Au) layer 12 are soldered and bonded with Sn-based solder 16.
Inventors:
Hironobu Baba
Takao Yoneyama
Muneo Tamura
Takao Yoneyama
Muneo Tamura
Application Number:
JP4819093A
Publication Date:
September 25, 2001
Filing Date:
March 09, 1993
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01L9/04; G01L9/00; H01L29/84; (IPC1-7): G01L9/04; H01L29/84
Domestic Patent References:
| JP368829A | ||||
| JP5234632A | ||||
| JP1173847A |
Attorney, Agent or Firm:
Hironobu Onda