Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BONDING METHOD FOR BEAM LEAD SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS5418674
Kind Code:
A
Abstract:
PURPOSE:To avoid the malformation and floating of the lead and thus to reduce the heat resistance of the semiconductor element when a number of beam leads formed on the electrode of the element are pressure-bonded onto the substrate, by first bonding part of the leads while putting it close to the element and then all the rest leads.

More Like This:
JPH04259232METHOD FOR MOUNTING SEMICONDUCTOR CHIP
JPH08222608BONDING DEVICE
JP2023081520CONNECTION METHOD OF ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF DISPLAY DEVICE
Inventors:
HAYASHI KUNIHIKO
Application Number:
JP8389477A
Publication Date:
February 10, 1979
Filing Date:
July 13, 1977
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU LTD
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60



 
Previous Patent: SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Next Patent: SEALING METHOD FOR SEMICONDUCTOR ELEMENT