Title:
BONDING METHOD OF NOZZLE PLATE
Document Type and Number:
Japanese Patent JP3292442
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To increase the bond strength between a nozzle plate and an actuator by curing an adhesive without leaving bubbles as they are.
SOLUTION: A nozzle plate 4 is stacked over an actuator 19 with an adhesive sandwiched in between, then a heater block 32 is brought into contact with the upper surface of the nozzle plate 4, and the adhesive is heated through the nozzle plate 4. At the same time, the adhesive is pressed from above the heater block 32. Thus it is possible to rapidly increase the temperatures of the adhesive and cure it after releasing a gas completely.
Inventors:
Nobuo Aoki
Application Number:
JP6918296A
Publication Date:
June 17, 2002
Filing Date:
February 28, 1996
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B41J2/045; B41J2/055; B41J2/16; (IPC1-7): B41J2/16; B41J2/045; B41J2/055
Domestic Patent References:
| JP81931A | ||||
| JP62264957A | ||||
| JP7314696A | ||||
| JP8187867A | ||||
| JP8156264A |
Attorney, Agent or Firm:
Katsunori Mutoh