Title:
BONDING OF POLYPHENYLENE SULFIDE RESIN TO TETRAFLUOROETHYLENE-ETHYLENE COPOLYMER RESIN
Document Type and Number:
Japanese Patent JPH02155943
Kind Code:
A
Abstract:
PURPOSE:To form a resin compsn. capable of bonding a polyphenylene sulfide resin molding to a tetrafluoroethylene-ethylene copolymer resin by compounding a polyphenylene sulfide, a tetrafluoroethylene-ethylene copolymer and an ultrafine particle. CONSTITUTION:A resin compsn. obtd. by compounding a polyphenylene sulfide (PPS), a tetrafluoroethylene-ethylene copolymer (ETFE) and an ultrafine particle is used as an adhesive for bonding a PPS molding to an ETFE molding. Namely, bonding parts of said moldings and the adhesive are melted at a temp. above the m.p. of PPS and ETFE but below 400 deg.C and in a molten state, both members are joined together by using the adhesive and cooled down while keeping the bonded state.
Inventors:
ONISHI SHUNJI
ICHIKAWA YOSHINORI
TAKEUCHI JUNJI
ICHIKAWA YOSHINORI
TAKEUCHI JUNJI
Application Number:
JP30942988A
Publication Date:
June 15, 1990
Filing Date:
December 07, 1988
Export Citation:
Assignee:
ONISHI SHUNJI
TONEN SEKIYUKAGAKU KK
TONEN SEKIYUKAGAKU KK
International Classes:
B32B27/08; C08L27/12; C08L81/02; C08L87/00; C09J5/06; C09J127/12; C09J127/20; C09J159/00; C09J181/02; (IPC1-7): B32B27/08; C08L27/12; C08L81/02; C09J5/06; C09J127/20; C09J181/02