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Title:
BONDING OF POLYPHENYLENE SULFIDE RESIN WITH POLYVINYLIDENE FLUORIDE RESIN
Document Type and Number:
Japanese Patent JPH02120364
Kind Code:
A
Abstract:
PURPOSE:To obtain a resin composition useful for bonding a polyphenylene sulfide resin molding with a polyvinylidene fluoride resin molding by mixing polyphenylene sulfide with polyvinylidene fluoride and ultramicroparticles. CONSTITUTION:Polyphenylene sulfide and polyvinylidene fluoride in such amounts that the mixing ratio of the latter to the former is 5-35vol.% and ultramicroparticles (e.g., ferrite microparticles) preferably of a particle diameter <=10mum in an amount corresponding to a filling ratio of 2-8vol.% are mixed by, for example, melt blending.

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Inventors:
ONISHI SHUNJI
ICHIKAWA YOSHINORI
TAKEUCHI JUNJI
Application Number:
JP27243088A
Publication Date:
May 08, 1990
Filing Date:
October 28, 1988
Export Citation:
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Assignee:
ONISHI SHUNJI
TONEN SEKIYUKAGAKU KK
International Classes:
B32B7/12; B32B27/30; C08J5/12; C08K3/00; C08L27/16; C08L81/02; C09J5/00; C09J127/06; C09J127/12; C09J127/16; C09J181/02; (IPC1-7): B32B7/12; B32B27/30; C08J5/12; C08L81/02; C09J127/06; C09J181/02



 
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