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Title:
BONDING STRUCTURE OF MEMBERS
Document Type and Number:
Japanese Patent JPS61211388
Kind Code:
A
Abstract:

PURPOSE: To freely adjust the bond strength between an adhesive and each member to be bonded, by bonding two members with an adhesive in such a manner that a third member which is different from each member in bond strength with the adhesive is provided on a bonding surface.

CONSTITUTION: A flexible sheet 20 is bonded to a fixing substrate 23 with an adhesive 28 in such a manner that a protruding member 26 which is different from the fixing plate 23 is bond strength with the adhesive 28 is previously spottily provided on the bonding surface on the fixing substrate 23, thereby to adjust the bond strength between the flexible sheet 20 and the fixing substrate 23. The material for the protruding member 26 varies depending on whether the bond strength between the adhesive 28 and the fixing substrate 23 should be increased or decreased. The size, shape, etc. of the protruding member 26 is also determined taking into consideration the bond strength. By the present invention, the bonding may be conducted, e.g. in such a manner that in releasing the flexible sheet 20 the adhesive 28 is left on the flexible sheet 20.


Inventors:
MIKAMI TETSUO
HOTTA HIDEKAZU
SAKANO HIROKAZU
SATO TOSHIYUKI
Application Number:
JP5183585A
Publication Date:
September 19, 1986
Filing Date:
March 15, 1985
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
TOSHIBA CORP
International Classes:
C09J5/00; (IPC1-7): C09J5/00
Domestic Patent References:
JPS4728941B1
JP52151161B
Attorney, Agent or Firm:
Honda Takashi



 
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