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Patent Searching and Data


Title:
BONDING STRUCTURE
Document Type and Number:
Japanese Patent JP2003232315
Kind Code:
A
Abstract:

To provide a bonding structure in which bonding strength is improved when a low viscosity bonding agent such as an instant glue is used for bonding, a bonding agent is easily flowed into bonded surfaces, a working property is efficient, and the bonding agent is not risen on a surrounding portion.

In the bonding structure bonding a first member and a second member, the low viscosity bonding agent is flowed into a bonded surfaces, in a state in which at least a part of a designated surface of the first and second members is kept in contact with each other as respective bonded surfaces. At least a groove extending to an outer periphery of the bonded surface is formed on at least one side of the bonded surfaces of the first and second members.


Inventors:
CHIYUUREI KIYOKAZU
Application Number:
JP2002031773A
Publication Date:
August 22, 2003
Filing Date:
February 08, 2002
Export Citation:
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Assignee:
CANON KK
International Classes:
G02B7/28; F16B11/00; G03B17/02; (IPC1-7): F16B11/00; G02B7/28; G03B17/02
Attorney, Agent or Firm:
Ryoichi Yamashita