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Patent Searching and Data


Title:
BONDING WIRE SEPARATING DEVICE
Document Type and Number:
Japanese Patent JP01110800
Kind Code:
A
Abstract:

PURPOSE: To obtain a device which enables bonding wires to separate automatically from each other by a method wherein wires whose tip end is separated are made to be inserted into grooves provided to, at least, one of a pair of rollers which rotate as they are in contact with each other, and both rollers are made to rotate.

CONSTITUTION: Grooves 12 are provided to, at least, one of a pair of rollers 11 and 13 which rotate as they are contacted with each other, a bonding wire 6 is composed of a signal wire 1 and a ground wire 2 which are coated with a coating resins 3 and 4 respectively and fixed together with a fixing resin 5, the bonding wire 6 with the separated tip of the fixing resin 5 is inserted into the grooves 12, and the rollers 11 and 13 are made to rotate respectively so as to separate automatically the signal wire 1 and the ground wire 2 coated with the coating resins 3 and 4 respectively from the fixing resin 5. By these processes, a bonding wire with a separated tip being inserted into grooves provided to rotating rollers, the bonding wire can be automatically separated, so that a separating operation of a bonding wire 6 is efficiently performed and therefore a bonding operation can be also improved in efficiency.


Inventors:
Sasazawa, Yoichi
Application Number:
JP1987000268522
Publication Date:
April 27, 1989
Filing Date:
October 23, 1987
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01R43/00; H01B13/012; H05K13/06; H01R43/00; H01B13/00; H05K13/06; (IPC1-7): H01R43/00; H05K13/06