ボンディングワイヤ垂直相互接続の構造

Title:

ボンディングワイヤ垂直相互接続の構造

Document Type and Number:

Japanese Patent JP7012765

Kind Code:

B2

Abstract:

A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.

Inventors:

Mow Fat Go
Gian Fan
Ya Pin Ju
Ji Kwan Park
Ken You Sung

Application Number:

JP2020036965A

Publication Date:

January 28, 2022

Filing Date:

March 04, 2020

Export Citation:

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Assignee:

ASM Technology Singapore Pte Ltd

International Classes:

H01L21/60

Domestic Patent References:

JP2015533258A
JP2012523118A
JP5013493A

Attorney, Agent or Firm:

Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe

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