Title:
BRAZED POROUS ALUMINUM SUBSTRATE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3900101
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a brazed porous aluminum substrate which retains practical levels of mechanical strengths such as tensile strength, bending strength and compression strength and is excellent in sound-absorption characteristic and vibration-damping property, and its manufacturing method.
SOLUTION: The porous aluminum substrate is obtained by forming a chip by cutting an aluminum clad material wherein the surface of aluminum material comprising aluminum or aluminum alloy is cladded with a brazing filler metal comprising aluminum alloy, molding the obtained chip into a prescribed shape and subjecting it to brazing treatment. The brazed porous aluminum substrate has a bulk density of 0.20-1.20 g/cm3 and a bonding ratio at intersection among chips of ≥25% and <50%. The method is for manufacturing such the brazed porous aluminum substrate.
Inventors:
Suzuki Hidenori
Ken Komatsu
Ken Komatsu
Application Number:
JP2003078871A
Publication Date:
April 04, 2007
Filing Date:
March 20, 2003
Export Citation:
Assignee:
NIPPON LIGHT METAL COMPANY,LTD.
International Classes:
B23K1/00; C22C21/00; B23K35/14; C22C1/08; G10K11/162; B23K103/10; (IPC1-7): C22C21/00; B23K1/00; C22C1/08; G10K11/162; //B23K35/14; B23K103:10
Domestic Patent References:
| JP60089534A | ||||
| JP11003082A | ||||
| JP60092436A | ||||
| JP2002030367A |
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Masahiro Koizumi
Tomohiro Nakamura
Masahiro Koizumi
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