Title:
BUNDLING METHOD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3260184
Kind Code:
B2
Abstract:
PURPOSE: To provide a bundling method and device therefor by which an article to be bundled can be assuredly and tightly bundled.
CONSTITUTION: A band part 2 of a bundling band 1 is bent by an cooperation of first and second guiding members 24, 26, and in addition, the band part 2 is inserted in a hole on a head part 3. The protruding part from the head part 3 of the band part 2 is pinched between a gear 43 and a band part pinching surface 46 of a guiding plate 45, and pulled. At the time the band part 2 is pulled, when the band part 2 comes into contact with at least one of reinforcing steels A, B, the engaging conditioning of a engaging arm 49 with the guiding plate 45 is held by the resistance of a damper 62, and the band part 2 is pulled at a low speed. When the reinforcing steels A, B are tightly tied by the bundling band 1, and the tension reaches a specified tension, the guiding plate 45 is released from the engaging arm 49 by resisting mainly to the elasticity of a compression spring 61, and moves a cutter plate 72 72, and then, the leading protruding part of the band part 2 which protrudes from the head part 3 is cut.
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Inventors:
Takao Kashihashi
Application Number:
JP32984892A
Publication Date:
February 25, 2002
Filing Date:
November 17, 1992
Export Citation:
Assignee:
Amano Co., Ltd.
Ryoichi Co., Ltd.
Ryoichi Co., Ltd.
International Classes:
B65B27/00; (IPC1-7): B65B27/00
Domestic Patent References:
| JP5848408A |
Attorney, Agent or Firm:
Keisuke Miyake
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